Position Description

Dynetics, a wholly owned subsidiary of Leidos, is seeking a talented Manufacturing Engineer to join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Dynetics provides responsive, cost-effective engineering, scientific and IT solutions.

The Manufacturing Engineer will have hands-on experience in developing, documenting, and executing manufacturing processes and procedures for electronic and electromechanical products. Candidate will support production of PCBA’s using latest surface mount technology processes including screen printing, solder paste AOI, SMT parts placement, reflow oven, post reflow AOI, X-ray, selective solder, de-paneling, underfill and conformal coating. Applicant will work with multi-disciplinary team to develop a wide variety of hardware, and work with the latest automated technology used in assembly and test equipment for printed circuit board assemblies.

The Manufacturing Engineer will support tasks such as review and approval of engineering drawings, bills of materials, customer quality requirements, and work instructions; participation in design reviews; and execution of manufacturing activities. Candidate will be required to work closely with the design team to complete all details of the design, to prepare the design for release to manufacturing. Candidate will also work closely with our quality team to develop processes that validate customer quality requirements.

Basic Qualifications

• Candidate must possess a Bachelor's of Science in an engineering field or equivalent degree from an ABET-accredited university and at least one (1) year of manufacturing engineering experience on programs designing and building electronic hardware to government specifications.
• In lieu of degree, High School Diploma/GED with a minimum of five (5) years of applicable experience is required.
• Candidate must have demonstrated experience with software that maintains bills of materials and other engineering design data.
• Candidate must have demonstrated experience effectively communicating within a team environment.
• Candidate must be a resident of the North Alabama area or willing to relocate to the Huntsville - North Alabama, AL area.

Other Qualifications

Preference shown to candidates who have experience and/or working knowledge of:

• SMT (Surface Mount Technology) processes and equipment.
• Electronics used on launch vehicles, targets, or missile components, and with production of cable harnesses, electronics, and electromechanical assemblies.
• Ability to provide Rough Order of Magnitude (ROM) estimates, Basis of Estimate (BOE) documents, and other documents used to support proposal efforts.
• Costpoint Material Planning software and/or Agile engineering design data management software.
• Experience in various quality roles.
• Manufacturing execution systems (MES).

Security Requirements

Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance or meet the eligibility to obtain (and maintain) a Secret Clearance.

Job Number:

01.01.10-2023-26

Closing Date:

11/12/2023